The new HDPLEX H5 case features a simpler / cleaner design and now supports 125W processors, including Alder Lake and the latest Ryzen chips. The H5 also features improved cooling fins and a very impressive 1kg copper CPU mounting system (eight heat pipes are included).
The H5 is a surprisingly flexible solution being compatible with ATX, microATX, mini-ITX motherboards, as well as ATX, FlexATX, SFX, and nano power supplies. The 3rd Gen H5 will be available globally in December for $398 / 366 euros.
Source: HDPLEX
