The latest iteration of HDPLEX's entry-level heat sink case features a new top panel that increases convection right above the CPU mounting system. The 3.5kg 270 x 264 x 63.5mm brushed-aluminum chassis supports mini-ITX, Thin mini-ITX, and more surprisingly NUC motherboards too (a fanless NUC kit is sold separately). The new H1 V3 handles CPUs up to 65W TDP and will be available in the coming weeks.
Source: HDPLEX
